Wafer Dicing along with Dicing Knives
Wafer dicing is among the processes popular in the semiconductor industry. It is a way of separating a die from a wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, by using dicing blades.
‘Wafer dicing methods’
Scribing and breaking – usually is performed in a substrate manufactured from a brittle material by which good-quality cutting surface of the substrate may be accomplished without any defects such as for example chippings on the substrate. This technique of semiconductor wafer separation is accomplished by developing a stress in the wafer and fracturing the wafer across the stress line. A line should be created in the wafer surface along the street where in fact the break is desired.
Mechanical sawing – the procedure is done using a mechanical machine called dicing saw; this method can be used for a micro electro-mechanical system semiconductor devices. While there are still manufacturers that utilize this method, it really is slowly getting unpopular because of several disadvantages – the process is slow, contaminant-laden, and dependent on regular shapes.
Laser cutting – a new and more effective technology to cut semiconductor materials; the procedure functions by directing the output of a high-power laser at the material to be cut. This process burns or vaporizes away the unwanted parts, leaving an edge with a high-quality surface finish.
As stated above, dicing blades are used and are an important element for the dicing process. There are several types of dicing blades and some of them are the following:
Hubbed Nickel Bonded Blades – this is used to cut Silicon and III-V materials. This blade is ultra-thin and created using a special electrodepositing strategy to contain the cutting diamonds in a nickel alloy matrix.
Hubbed Resin Bonded Blades – with this particular type of blade, you don’t have to buy expensive flanges as the resinoid blade is permanently mounted to its hub. As opposed to flanges, once the blade is dressed, it could be detached and reattached again without going through the dressing process.
Hubless Resin Bonden Blades – this sort of dicing blade performs very well on materials like ceramic, quartz, sapphire and glass. yoursite.com can give minimum chipping and superior finish.
Metal Sintered Dicing Blades – that is a type of blade that has been developed by capturing diamonds in a metal binder using sintering process – this is the very rigid blade and contains a very low wear rates. These properties provide capability to create very straight cuts even though subjected to large exposures.